LM7310 datasheet(18/44 Pages) TI

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7.3.7 Overtemperature Protection (OTP)

The device monitors the internal die temperature (TJ) at all times and shuts down the part as soon as the

temperature exceeds a safe operating level (TSD) thereby protecting the device from damage. The device will

not turn back on until the junction cools down sufficiently, that is the die temperature falls below (TSD - TSDHYS).

When the LM73100 detects thermal overload, it will shut down and remain latched-off until the device is power

cycled or re-enabled by toggling the EN/UVLO pin.

Table 7-1. Thermal Shutdown

Enter TSD

Exit TSD

TJ ≥ TSD

TJ < TSD - TSDHYS

VIN cycled to 0 V and then above VUVP(R) OR EN/UVLO toggled

below VSD(F)

7.3.8 Fault Response

The following table summarizes the device response to various fault conditions.

Table 7-2. Fault Summary

Event

Protection Response

Fault latched internally

Overtemperature

Shutdown

Undervoltage (UVP or UVLO)

Shutdown

Input Reverse Polarity

Shutdown

Overvoltage (1)

Shutdown

Reverse Current

Reverse Current Blocking

Short-circuit

Shutdown

Faults which are latched internally can be cleared either by power cycling the part (pulling VIN to 0 V and then

above VUVP(R)) or by pulling the EN/UVLO pin voltage below VSD(F).

During a latched fault, pulling the EN/UVLO just below the UVLO threshold (VUVLO(F)) has no impact on the

device.

LM7310

SNOSDC0 – OCTOBER 2020

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LM7310 Datasheet(PDF) 18 Page - Texas Instruments