ISO1640BDR datasheet(7/46 Pages) TI

7 / 46 page

MIN

NOM

MAX

UNIT

VSDA2,

VSCL2

I2C Input and output signal voltages, Side 2

VCC2

VIL1

I2C Low-level input voltage, Side 1

480

VIH1

I2C High-level input voltage, Side 1

0.7 × VCC1

VCC1

VIL2

I2C Low-level input voltage, Side 2

0.3 × VCC2

VIH2

I2C High-level input voltage, Side 2

0.5 × VCC2

VCC2

IOL1

I2C Output current, Side 1

0.5

3.5

IOL2

I2C Output current, Side 2

0.5

Capacitive load, Side 1

Capacitive load, Side 2

400

fMAX

I2C Operating frequency(1)

1.7

MHz

VILIO

Low-level input voltage, GPIO pins (ISO1644 only)

0.3 × VCC2

VIHIO

High-level input voltage, GPIO pins (ISO1644 only)

0.7 × VCC1

VCC1

IOHIO

GPIO High-level output current, VCCO = 5 V (ISO1644 only)

-4

GPIO High-level output current, VCCO = 3.3 V (ISO1644 only)

-2

GPIO High-level output current, VCCO = 2.5 V (ISO1644 only)

-1

IOLIO

GPIO Low-level output current, VCCO = 5 V (ISO1644 only)

GPIO Low-level output current, VCCO = 3.3 V (ISO1644 only)

GPIO Low-level output current, VCCO = 2.5 V (ISO1644 only)

fDR

GPIO maximum data rate frequency (ISO1644 only)

Mbps

Ambient temperature

–40

125

°C

(1)

Maximum frequency is a function of the RC time constant on the bus. If the system has less bus capacitance, then higher frequencies

can be achieved.

6.4 Thermal Information

THERMAL METRIC(1)

ISO1640/1

ISO1644

UNIT

D (SOIC)

DW (SOIC) DW (SOIC)

8 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

106.3

62.4

58.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

38.5

29.5

25.5

°C/W

RθJB

Junction-to-board thermal resistance

52.5

33.5

29.7

°C/W

ψJT

Junction-to-top characterization parameter

8.2

11.7

8.9

°C/W

ψJB

Junction-to-board characterization parameter

51.8

32.4

28.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO1640

Maximum power dissipation (both

sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, C1 = 20 pF, C2 = 400 pF, R1 =

1.4 kΩ, R2 = 94 Ω, Input a 1.7-MHz 50% duty-cycle clock signal

PD1

Maximum power dissipation (side-1)

PD2

Maximum power dissipation (side-2)

ISO1641

Maximum power dissipation (both

sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, C1 = 20 pF, C2 = 400 pF, R1 =

1.4 kΩ, R2 = 94 Ω, Input a 1.7-MHz 50% duty-cycle clock signal

PD1

Maximum power dissipation (side-1)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, C1 = 20 pF, C2 = 400 pF, R1 =

1.4 kΩ, R2 = 94 Ω, Input a 1.7-MHz 50% duty-cycle clock signal

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ISO1640, ISO1641, ISO1644

SLLSFC2C – MAY 2021 – REVISED JUNE 2021

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