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LTC6948 Datasheet(PDF) 14 Page - Analog Devices

Part # LTC6948
Description  300MHz to 9GHz High Linearity I/Q Demodulator with Wideband IF Amplifier
PDF  32 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LTC6948 Datasheet(HTML) 14 Page - Analog Devices

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LTC5594
14
Rev A
For more information www.analog.com
BLOCK DIAGRAM
4
2
25
26
20
19
32 31
29
28
6
9
10
12
13
15
16
23
22
21
17
24
33
18
7
3
5
8
1
27
0º
90º
RF
SPI
IFIP
IFIM
TEMP
LO MATCH
ADJUST
MIP
MIM
AIP
VCM
FINE GAIN/DC OFFSET/
DISTORTION ADJUST
MQP
AIM
MQM AQM
AQP
IFQM
IFQP
LOP
LOM
SCK
SDI
SDO
CSB
OVDD
ADJUST
REGISTERS
EXPOSED
PAD
GND
GND
BIAS
VCC
EN
FINE GAIN/DC OFFSET/
DISTORTION ADJUST
GND
GND
8 STEPS
8 STEPS
AMPD
AMPD
5594 BD01
–
–
+
+
couplingcapacitor;1000pFisrecommended.Whendriven
single-ended, the unused pin should be terminated with
50Ω in series with the DC-blocking capacitor.
SDO (Pin 21): Serial Data Output. This output can accom-
modate logic levels from 1.2V to 3.3V. During read-mode,
data is read out MSB first.
SDI (Pins 22): Serial Data Input. Data is clocked MSB first
into the mode-control registers on the rising edge of SCK.
SDI can be driven with 1.2V to 3.3V logic levels.
SCK (Pin 23): Serial Clock Input. SDI can be driven with
1.2V to 3.3V logic levels.
OVDD (Pin 24): Positive Digital Interface Supply Pin. This
pin sets the logic levels for the digital interface. 1.2V to
3.3V can be used. This pin should be bypassed with a 1µF
PIN FUNCTIONS
capacitortoground.TheVCCsupplymustbeappliedbefore
the OVDD supply to prevent damage to the ESD diodes.
AMPD (Pin 27): IF Amplifier Disable Pin. A logic high
on this pin will disable the IF amplifiers. The state of the
IF amplifers is the logical AND of AMPD and the EAMP
register. An internal 200k pull-down resistor ensures the
IF amplifiers are enabled by default if the is no connection
to the pin (open-circuit condition).
GND (Pins 1, 3, 5, 8, Exposed Pad Pin 33): Ground. These
pinsmustbesolderedtothecircuitboardRFgroundplane.
Thebacksideexposedpadgroundconnectionshouldhave
a low inductance connection and good thermal contact
to the printed circuit board ground plane using many
through-hole vias. See layout information.



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