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DS20006554A Datasheet(PDF) 88 Page - Microchip Technology |
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DS20006554A Datasheet(HTML) 88 Page - Microchip Technology |
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88 / 94 page ![]() ZL30260-ZL30263 Data Sheet 88 © 2021 Microchip Technology Inc. DS20006554A 8. Package and Thermal Information Table 23 - 8x8mm QFN Package Thermal Properties PARAMETER SYMBOL CONDITIONS VALUE UNITS Maximum Ambient Temperature TA 85 C Maximum Junction Temperature TJMAX 125 C Junction to Ambient Thermal Resistance (Note 1) JA still air 15.1 C/W 1m/s airflow 12.4 2.5m/s airflow 10.6 Junction to Board Thermal Resistance JB 3.2 C/W Junction to Case Thermal Resistance JC 7.3 C/W Junction to Pad Thermal Resistance (Note 2) JP Still air 0.9 C/W Junction to Top-Center Thermal Characterization Parameter JT Still air 0.1 C/W Note 1: Theta-JA ( JA) is the thermal resistance from junction to ambient when the package is mounted on an 8-layer JEDEC standard test board and dissipating maximum power. Note 2: Theta-JP ( JP) is the thermal resistance from junction to the center exposed pad on the bottom of the package. Note 3: For all numbers in the table, the exposed pad is connected to the ground plane with a 9x9 array of thermal vias; via diameter 0.33mm; via pitch 0.76mm. |
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