MIN

NOM

MAX

UNIT

Low-level input voltage, Side 2

0

V

High-level input voltage, Side 2

V

I2C Output current, Side 1

0.5

3.5

mA

I2C Output current, Side 2

0.5

50

mA

C1

Capacitive load, Side 1

80

pF

C2

Capacitive load, Side 2

400

pF

I2C Operating frequency(1)

1.7

MHz

Ambient temperature

–40

25

125

°C

(1)

Maximum frequency is a function of the RC time constant on the bus. Higher frequencies can be achieved when the system has less

bus capacitance.

6.4 Thermal Information

THERMAL METRIC(1)

ISO1640-Q1

UNIT

D (SOIC)

DW (SOIC)

8 PINS

16 PINS

Junction-to-ambient thermal resistance

106.3

62.4

°C/W

Junction-to-case (top) thermal resistance

38.5

29.5

°C/W

Junction-to-board thermal resistance

52.5

33.5

°C/W

Junction-to-top characterization parameter

8.2

11.7

°C/W

Junction-to-board characterization parameter

51.8

32.4

°C/W

Junction-to-case (bottom) thermal resistance

-

-

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO1640

Maximum power dissipation (both

sides)

1.4 kΩ, R2 = 94 Ω, Input a 1.7-MHz 50% duty-cycle clock signal

96

mW

Maximum power dissipation (side-1)

43

mW

Maximum power dissipation (side-2)

53

mW

ISO1640-Q1

SLLSFC3A – MARCH 2020 – REVISED DECEMBER 2021

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