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TPSM82821 Datasheet(PDF) 47 Page - Texas Instruments |
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TPSM82821 Datasheet(HTML) 47 Page - Texas Instruments |
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47 / 54 page ![]() www.ti.com PACKAGE OUTLINE C 2 8X 0.5 10X 0.3 0.2 10X 0.7 0.6 1.1 MAX (0.05) TYP COPPER PULLBACK B 2.1 1.9 A 2.6 2.4 (2) (1.25) uSIP - 1.1 mm max height SIL0010D MICRO SYSTEM IN PACKAGE 4223961/D 09/2019 PIN 1 INDEX AREA PICK AREA NOTE 3 0.08 C SEATING PLANE 0.1 C A B 0.05 C 1 5 10 SYMM SYMM 6 PIN 1 ID 10X EXPOSED COPPER SOLDER MASK MicroSiP is a trademark of Texas Instruments TM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Pick and place nozzle 0.33 mm or smaller recommended. SCALE 6.000 www.ti.com TPSM82823, TPSM82822, TPSM82821, TPSM82823A, TPSM82822A, TPSM82821A SLVSEP0F – AUGUST 2019 – REVISED NOVEMBER 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 47 Product Folder Links: TPSM82823 TPSM82822 TPSM82821 TPSM82823A TPSM82822A TPSM82821A |
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