ADM7151 datasheet(9/45 Pages) AD

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Data Sheet

LT3097

ABSOLUTE MAXIMUM RATINGS

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Table 2. Absolute Maximum Ratings

Parameter

Value

INP Pin Voltage

±22 V

INN Pin Voltage

with Respect to GND Pin

–22 V to +0.3 V

ENP/UVP Pin Voltage

±22 V

ENN/UVN Pin Voltage

with Respect to INN Pin1

–0.3 V to +30 V

with Respect to GND Pin

±22 V

INP-to-ENP/UVP Differential

±22 V

PGP Pin Voltage2

–0.3 V, +22 V

PGN Pin Voltage

with Respect to INN Pin1

–0.3 V to +30 V

with Respect to GND Pin

–0.3 V to +22 V

ILIMP Pin Voltage2

–0.3 V, +1 V

ILIMN Pin Voltage

with Respect to INN Pin1

–0.3 V to +22 V

PGFBP Pin Voltage2

–0.3 V, +22 V

PGFBN Pin Voltage

with Respect to INN Pin1

–0.3 V to +30 V

with Respect to GND Pin

±22 V

SETP Pin Voltage2

–0.3 V, +16 V

SETP Pin Current3

±20 mA

SETN Pin Voltage

with Respect to INN Pin1

–0.3 V, +22 V

with Respect to GND Pin

±22 V

SETN Pin Current4

±10 mA

OUTSP Pin Voltage2

–0.3 V, +16 V

OUTSP Pin Current3

±20 mA

OUTSN Pin Voltage

with Respect to INN Pin1

–0.3 V, +22 V

with Respect to GND Pin

±22 V

OUTSN Pin Current4

±10 mA

SETN-to-OUTSN Differential5

±22 V

OUTP Pin Voltage2

–0.3 V, +16 V

OUTN Pin Voltage

with Respect to INN Pin1

–0.3 V, +22 V

with Respect to GND Pin

±22 V

OUTP-to-OUTSP Differential6

±1.2 V

OUTN-to-OUTSN Differential7

±22 V

INP-to-OUTP Differential

±22 V

INP-to-OUTSP Differential

±22 V

Output Short-Circuit Duration

Indefinite

Temperature

Operating TJ Range8, A Grade

–40°C to +125°C

Storage Range

–65°C to +150°C

1 Parasitic diodes exist internally between the ENN/UVN, ILIMN, PGN, PGFBN,

SETN, GND, OUTSN, and OUTN pins and the INN pin. Do not drive the

ENN/UVN, ILIMN, PGN, PGFBN, SETN, GND, OUTSN, and OUTN pins more

than 0.3 V below the INN pin voltage during a fault condition. The ENN/UVN,

ILIMN, PGN, PGFBN, SETN, GND, OUTSN, and OUTN pins must remain at a

voltage more positive than INN during normal operation.

2 Parasitic diodes exist internally between the ILIMP, PGP, PGFBP, SETP,

OUTSP, and OUTP pins and the GND pin. Do not drive the ILIMP, PGP,

PGFBP, SETP, OUTSP, and OUTP pins more than 0.3 V below the GND pin

voltage during a fault condition. The ILIMP, PGP, PGFBP, SETP, OUTSP, and

OUTP pins must remain at a voltage more positive than GND during normal

operation.

3 SETP and OUTSP pins are clamped using diodes and two 25 Ω series

resistors. For less than 5 ms transients, this clamp circuitry can carry more

than the rated current. For more details, see the Figure 122 and the Protection

Features section.

4 SETN and OUTSN pins are clamped using diodes and two 400 Ω series

resistors. For less than 5 ms transients, this clamp circuitry can carry more

than the rated current. For more details, see the Figure 123 and the Protection

Features section.

5 Maximum SETN and OUTSN pin current requirement must be satisfied.

6 Maximum OUTP-to-OUTSP differential is guaranteed by design.

7 Maximum OUTN-to-OUTSN differential is guaranteed by design.

8 The LT3097 is tested and specified under pulse load conditions such that TJ

≈ TA. The LT3097 is tested at TA = 25°C. Performance of the LT3097 over

the full –40°C to 125°C operating temperature range is assured by design,

characterization, and correlation with statistical process controls. The LT3097

is guaranteed over the full –40°C to 125°C operating TJ range.

Stresses at or above those listed under Absolute Maximum Ratings

can cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods can affect product reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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