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ADM7151 Datasheet(PDF) 12 Page - Analog Devices

Part # ADM7151
Description  Dual 500mA, Positive/Negative, Ultra-Low Noise, Ultra-High PSRR Low Dropout Linear Regulator
PDF  45 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADM7151 Datasheet(HTML) 12 Page - Analog Devices

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Data Sheet
LT3097
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
analog.com
Rev. 0 | 12 of 45
Table 3. Pin Function Descriptions (Continued)
Pin No.
Mnemonic
Description
20
OUTSP
Positive Output Sense. The OUTSP pin is the noninverting input to the error amplifier of the positive regulator. For optimal transient performance
and load regulation, Kelvin connects OUTSP directly to the positive output capacitor and the positive load. In addition, connect the GND
connections of the positive output capacitor and the SETP pin capacitor directly together. Exercise care with regard to the placement of positive
input capacitors relative to positive output capacitors due to potential PSRR degradation from magnetic coupling effects; see PSRR and Input
Capacitance for further information on capacitor placement and board layout. A parasitic-substrate diode exists between the OUTSP and GND
pins of the LT3097; therefore, do not drive OUTSP more than 0.3 V below GND during normal operation or a fault condition.
21, 22
OUTP
Positive Output. The OUTP pins supply power to the positive load. For stability, use a minimum 10 µF output capacitor with an ESR of less than
20 mΩ and an ESL of less than 2 nH. Large load transients require larger output capacitance to limit peak-voltage transients. See the Stability
and Output Capacitance section for more information on positive output capacitance. A parasitic-substrate diode exists between the OUTP and
GND pins of the LT3097; therefore, do not drive OUTP more than 0.3 V below GND during normal operation or a fault condition.
23
EPAD (GND)
Ground Exposed Pad. The ground exposed pad is an electrical connection to pin 19 GND. To ensure proper electrical and thermal performance,
solder the exposed backside to the PCB ground and connect it directly to the pin 19 GND.
24
EPAD (INN)
INN Exposed Pad. The INN exposed pad is an electrical connection to INN. To ensure proper electrical and thermal performance, solder the
INN exposed backside directly to the INN pins 6 and 7.



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