ERTEC datasheet(48/51 Pages) RENESAS

Part #	ERTEC

Description	Enhanced Real-Time Ethernet Controller with 32-bit RISC CPU Core

PDF	51 Pages

Scroll/Zoom	100%

Manufacturer	RENESAS [Renesas Technology Corp]

Direct Link	http://www.renesas.com

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48 / 51 page

Data Sheet A17989EE2V0DS00

µPD800261

Recommended Soldering Conditions

Solder this product under the following recommended conditions.

For details of the recommended soldering conditions, refer to the information document

Semiconductor Device Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended please consult NEC.

•

for µPD800261F1-816-HN2-A (lead free device)

Note: The number of days refers to storage at 25°C, 65% RH MAX after the dry pack has been

opened.

After that, prebaking is necessary at 125 °C for 10 to 72 hours.

Table 4-1:

Soldering Conditions for Lead-free Device

Soldering Method

Soldering Condition

Symbol of Recommended Soldering

Condition

Infrared reflow

Package peak temperature: 260°C,

Time: 60 seconds max. (220°C min.),

Number of times: 3 max.,

Number of days: 7 Note

IR60-107-3

ERTEC Datasheet(PDF) 48 Page - Renesas Technology Corp