DSP56004ROM datasheet(26/82 Pages) FREESCALE

26 / 82 page

2-2

DSP56004/D, Rev. 3

MOTOROLA

Specifications

Thermal characteristics

THERMAL CHARACTERISTICS

Table 2-1

Maximum Ratings (GND = 0 Vdc)

Rating

Symbol

Value

Unit

Supply Voltage

VCC

–0.3 to +7.0

All Input Voltages:

•

50 and 66 MHz

•

81 MHz

VIN

(GND – 0.5) to (VCC + 0.5)

(GND – 0.25) to (VCC + 0.25)

Current Drain per Pin excluding VCC and GND

Operating Temperature Range:

•

50 and 66 MHz

•

81 MHz

–40 to +125

–40 to +120

°C

Storage Temperature

TSTG

–55 to +125

°C

Table 2-2

Thermal Characteristics

Characteristic

Symbol

QFP Value3

QFP Value4

Unit

Junction-to-ambient thermal resistance1

RθJA or θJA

70.4

45.1

˚C/W

Junction-to-case thermal resistance2

RθJC or θJC

16.4

—

˚C/W

Thermal characterization parameter

3.2

—

˚C/W

Notes:

Junction-to-ambient thermal resistance is based on measurements on a horizontal-single-sided

Printed Circuit Board per SEMI G38-87 in natural convection.(SEMI is Semiconductor Equipment

and Materials International, 805 East Middlefield Rd., Mountain View, CA 94043, (415) 964-5111)

Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-

88, with the exception that the cold plate temperature is used for the case temperature.

These are measured values. See note 1 for test board conditions.

These are measured values; testing is not complete. Values were measured on a non-standard

four-layer thermal test board (two internal planes) at one watt in a horizontal configuration.

Freescale Semiconductor, Inc.

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