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MPXY8300 Datasheet(PDF) 2 Page - Freescale Semiconductor, Inc |
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MPXY8300 Datasheet(HTML) 2 Page - Freescale Semiconductor, Inc |
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2 / 164 page ![]() MPXY8300 Series Sensors 2 Freescale Semiconductor SECTION 1 GENERAL DESCRIPTION 1.1 Overall Block Diagram The block diagram of the device is shown in Figure 1-1. This diagram covers all the main blocks mentioned above and their main signal interactions. Power management controls and bus control signals are not shown in this block diagram for clarity. 1.2 Multi-Chip Interface The device contains four devices using the best process technology for each. • Microcontroller (MCU) • RF transmitter device (RFX) • Pressure sensing device (P-CHIP) • Z- and X-axis acceleration transducer (g-Cell) As shown in Figure 1-1 the MCU interfaces to the RFX using a standard serial peripheral interface (SPI) which creates a separate data and address bus structure within the RFX. The P-Chip and g-Cell both interface to the MCU. 1.3 System Clock Distribution The various clock sources and their distribution are shown in Figure 1-2. Note that most clock sources and distribution are limited to one device, while the SFO, DX and SPI clocks are connected between devices. All clock sources except the low frequency oscillator, LFO, can be turned off by software control in order to conserve power. The LFO is used for: • Slow periodic wake-up of the MCU (see Section 11) • Slow periodic wake-up of LF receiver (LFR) (see Section 12) ORDERING INFORMATION MPXY8300 Series Order Numbers Temperature Range Case No. Package MPXY8300A6T1 -40 °C to 125°C 1793-03 SOIC-20, Tape and Reel MPXY8300A6U -40 °C to 125°C 1793-03 SOIC-20, Rail MPXY8300B6T1 -40 °C to 125°C 1793-03 SOIC-20, Tape and Reel MPXY8300B6U -40 °C to 125°C 1793-03 SOIC-20, Rail MPXY8300C6T1 -40 °C to 125°C 1793-03 SOIC-20, Tape and Reel MPXY8300C6U -40 °C to 125°C 1793-03 SOIC-20, Rail |
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