TDA4VM21 datasheet(320/331 Pages) TI

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9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

Changes from August 28, 2021 to April 22, 2024 (from Revision J (August 2021) to Revision K

(April 2024))

Page

• Global:: Updated document title........................................................................................................................ 1

• Global:: Added Silicon Revision 2.0 (SR2.0) device-specific info throughout the document.............................1

• Global:: Moved the Revision History section to the back of the document........................................................1

• Global:: Deleted all OLDI/LVDS content; n/a to this device suite...................................................................... 1

• Global:: Deleted the "Power Consumption Summary" section (was after Section 6.5, Operating Performance

Points).................................................................................................................................................................1

• (Features): Updated/Changed the "Supports speeds up to 3733 MT/s" bullet from "3733" to "4266" MT/s...... 1

• (Features): Updated/Changed the Integrated Ethernet switch bullets and sub-bullets...................................... 1

• (Features): Updated/Changed the "32-bit data bus with inline ECC ..." sub-bullet under the EMIF module......1

• (Description): Updated the lead-in sentence...................................................................................................... 3

• (Package Information): Updated/Changed the "Device Information" table to "Package Information" table and

revamped table content to new format............................................................................................................... 3

• (Device Comparison): Added SDK software build sheet Note........................................................................... 4

• (Device Comparison): Updated/Changed the MSMC capacity for TDA4VM67 and TDA4VM21 devices to

"8MB". Now all devices: TDA4VM88, TDA4VM67, and TDA4VM21 are "8MB (On-Chip SRAM with ECC)".... 7

• (Device Comparison): Added SDK software build sheet Note........................................................................... 7

• (Pin Attributes): Added the secondary pin multiplexing functions for the DSI and controlled by CTRLMMR

regs...................................................................................................................................................................12

• (Pin Attributes): Added the secondary pin multiplexing functions for the MCU_ADC and controlled by

CTRLMMR regs................................................................................................................................................12

• (Pin Attributes): Added "The MUXMODE field is not used to select …" footnote for the WKUP_GPIO0_[68:83]

signals in the Pin Attributes table..................................................................................................................... 12

• (Pin Attributes): Added reset states to the BALL RESET STATE column for mmc0_* pins in the Pin Attributes

table.................................................................................................................................................................. 12

• (WKUP Domain GPIO0 Signal Descriptions): Added missing WKUP_GPIO0_[68:83] signals........................85

• (Power Supply Signal Description): Added "±10%" to the "This pin must always be … capacitor to

VSS" footnote................................................................................................................................................. 131

• (Connections for Unused Pins): Added the "VMON_ER_VSYS" (M26) and "VMON_IR_VEXT" (V19) signals

to the "Each of these balls must be connected to VSS .." CONNECTIONS REQUIREMENT.......................150

TDA4VM-Q1, TDA4VM

SPRSP36K – SEPTEMBER 2021 – REVISED APRIL 2024

www.ti.com

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