LX7220

DS20006704A-page 16

 2022 Microchip Technology Inc. and its subsidiaries

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b1

E2

A3

e

L1

E

N

0.50 BSC

0.203 REF

0.35

0.20

0.80

0.00

0.25

0.40

0.85

0.02

3.00 BSC

MILLIMETERS

MIN

NOM

14

0.45

0.30

1.00

0.05

MAX

Overall Length

Exposed Pad Length

D

D2

0.55

2.00 BSC

0.60

0.65

0.55

0.60

0.65

Terminal Width

b2

0.15

0.20

0.25

Terminal Length

L2

0.55

0.60

0.65

Exposed Pad Offset

E3

0.26 BSC

14-Lead Very Thin Quad Flat, No Lead Package (NVC) - 2x3x1.0 mm Body [VQFN]

With 0.6 mm Exposed Pad; Microsemi Legacy Package

Microchip Technology Drawing C04-25488 Rev A