6

NXP Semiconductors

33879

4

Electrical characteristics

4.1

Maximum ratings

Table 4. 33879 maximum ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage

to the device.

Symbol

Ratings

Value

Unit

Notes

Electrical ratings

VDD

VDD Supply Voltage

-0.3 to 7.0

VDC

(1)

–

CS

, DI, DO, SCLK, IN5, IN6, and EN

-0.3 to 7.0

VDC

(1)

VPWR

VPWR Supply Voltage

• 33879

• 33879A

-16 to 40

-16 to 45

VDC

(1)

ECLAMP

Output Clamp Energy

50

mJ

(2)

VESD1

VESD2

VESD1

VESD2

ESD Voltage

• Human Body Model 33879

• Machine Model 33879

• Human Body Model 33879A

• Machine Model 33879A

±450

±100

±2000

±200

V

(3)

Thermal ratings

TA

TJ

TC

Operating Temperature

• Ambient

• Junction

• Case

-40 to 125

-40 to 150

-40 to 125

°C

TSTG

Storage Temperature

-55 to 150

°C

PD

Power Dissipation

1.7

W

(4)

RθJA

RθJC

Thermal Resistance

• Junction to Ambient

• Between the Die and the Exposed Die Pad

71

1.2

°C/W

TPPRT

Peak Package Reflow Temperature During Reflow

Note 6

°C

(5), (6)

Notes

1.

Exceeding these limits may cause malfunction or permanent damage to the device.

2.

Maximum output clamp energy capability at 150

°C junction temperature using single non-repetitive pulse method with I = 350 mA.

3.

ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in accordance

with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).

4.

Maximum power dissipation at TA = 25 °C with no heatsink used.

5.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause

malfunction or permanent damage to the device.

6.

NXP’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and

Moisture Sensitivity Levels (MSL), Go to www.NXP.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all

orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.