TMP401

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SBOS371B – AUGUST 2006 – REVISED OCTOBER 2014

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Power supply, V+

7.0

V

Input and output voltage(2)

–0.5

(V+) + (0.5)

V

Input current

10

mA

Operating temperature range

–55

+125

°C

Junction Temperature (TJ max)

+150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input voltage rating applies to all TMP401 input and output pins.

6.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

–60

+130

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

–3000

3000

pins(1)

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

–1000

1000

JESD22-C101, all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

V+

Positive supply (3 V to 5.5 V)

5

V

TA

Ambient temperature

25

°C

6.4 Thermal Information

TMP401

THERMAL METRIC(1)

DGK (VSSOP)

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance

78.8

RθJC(top)

Junction-to-case (top) thermal resistance

71.6

RθJB

Junction-to-board thermal resistance

68.2

°C/W

ψJT

Junction-to-top characterization parameter

22.0

ψJB

Junction-to-board characterization parameter

67.6

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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