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LM43602 Datasheet(PDF) 36 Page - Texas Instruments |
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LM43602 Datasheet(HTML) 36 Page - Texas Instruments |
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36 / 44 page ![]() SW VIN PGND CBOOT VCC BIAS SYNC RT PGOOD EN SS/TRK AGND FB SW PGND VIN PAD (17) 1 16 2 3 4 5 6 8 7 9 15 14 13 12 11 10 VIN COUT CBOOT CIN CVCC VOUT CBIAS RFBT RFBB CFF L GND Route VOUT sense trace away from SW and VIN nodes. Preferably shielded in an alternative layer GND Plane VOUT sense point is away from inductor and past COUT Thermal Vias under DAP As much copper area as possible, for better thermal performance + Place bypass caps close to terminals As much copper area as possible, for better thermal performance VOUT distribution point is away from inductor and past COUT TO LOAD Ground bypass caps to DAP Place ceramic bypass caps close to VIN and PGND terminals 36 LM43602-Q1 SNVSA83C – APRIL 2015 – REVISED OCTOBER 2017 www.ti.com Product Folder Links: LM43602-Q1 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated 10.2 Layout Example Figure 65. LM43602-Q1 Layout Example |
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