ADS1291IRSMT datasheet(6/83 Pages) TI2

6 / 83 page

ADS1291, ADS1292, ADS1292R

SBAS502C – DECEMBER 2011 – REVISED APRIL 2020

www.ti.com

Product Folder Links: ADS1291 ADS1292 ADS1292R

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

AVDD to AVSS

–0.3

5.5

DVDD to DGND

–0.3

3.9

AVSS to DGND

–3

0.2

Analog input to AVSS

AVSS – 0.3

AVDD + 0.3

Digital input to DVDD

DVSS – 0.3

DVDD + 0.3

Input current to any pin except supply pins

±10

Input current

Momentary

±100

Continuous

±10

Operating temperature range

–40

+85

°C

Maximum junction temperature (TJ)

150

°C

Storage temperature, Tstg

–60

+150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

AVDD

Analog power supply, AVDD to AVSS

2.7

5.25

DVDD

Digital power supply, DVDD to DGND

1.7

3.6

Analog input voltage

AVSS

AVDD

Digital input voltage

DVSS

DVDD

Operating ambient temperature

–40

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

ADS1291, ADS1292, ADS1292R

UNIT

PBS (TQFP)

RSM (VQFN)

32 PINS

RθJA

Junction-to-ambient thermal resistance

68.4

33.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

25.9

36.4

°C/W

RθJB

Junction-to-board thermal resistance

30.5

25.2

°C/W

ψJT

Junction-to-top characterization parameter

0.5

0.2

°C/W

ψJB

Junction-to-board characterization parameter

24.3

7.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

2.2

°C/W

ADS1291IRSMT Datasheet(PDF) 6 Page - Texas Instruments

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