9 Device and Documentation Support

9.1 Documentation Support

9.1.1 Related Documentation

For related documentation see the following:

• Texas Instruments, TMP102-Q1 Low-Power Digital Temperature Sensor With SMBus and Two-Wire Serial

Interface in SOT563, data sheet

• Texas Instruments, TMP75B-Q1 1.8V Digital Temperature Sensor With Two-Wire Interface and Alert, data

sheet

• Texas Instruments, TMPx75-Q1 Automotive Grade Temperature Sensor With I 2C and SMBus Interface in

Industry-Standard LM75 Form Factor and Pinout, data sheet

• Texas Instruments, TMP112-Q1 Functional Safety FIT Rate, FMD and Pin FMA, Functional safety information

• Texas Instruments, Designing and Manufacturing with TI's X2SON Packages, design guide

9.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.4 Trademarks

SMBus™ is a trademark of Intel, Inc.

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

9.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (June 2022) to Revision G (May 2025)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Added TMP112D-Q1 device Specs and graphs throughout the document........................................................1

• Added “Device Comparison” table, “Device Orderable Options” table, and “Device Nomenclature” image...... 3

• Added “Active conversion Supply current” and “Standby current” from the context to the Electrical

Characteristics table for TMP112-Q1..................................................................................................................7

• Added “Fast Mode Plus” to I2C Timing Requirements table.............................................................................. 9

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TMP112-Q1, TMP112D-Q1

SLOS887G – SEPTEMBER 2014 – REVISED MAY 2025

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Product Folder Links: TMP112-Q1 TMP112D-Q1