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PACKAGE OUTLINE

C

10X

0.30

0.18

2.4 0.1

2X

2

1.65 0.1

8X 0.5

1.0

0.8

10X

0.5

0.3

0.05

0.00

A

3.1

2.9

B

3.1

2.9

(0.2) TYP

4X (0.25)

2X (0.5)

VSON - 1 mm max height

DRC0010J

PLASTIC SMALL OUTLINE - NO LEAD

4218878/B 07/2018

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

5

6

10

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

C

THERMAL PAD

EXPOSED

SYMM

SYMM

11

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

SCALE 4.000