TPS22954DSQR datasheet(29/51 Pages) TI2

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J(max)

D(max)

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SLVSCT5D – MARCH 2015 – REVISED SEPTEMBER 2016

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10 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

10.1 Application Information

This section will highlights some of the design considerations when implementing this device in various

applications. A PSPICE model for this device is also available on www.ti.com for further aid.

10.1.1 Input to Output Voltage Drop

The input to output voltage drop in the device is determined by the RON of the device and the load current. The

RON of the device depends upon the VIN and VBIAS conditions of the device. Refer to the RON specification of the

device in the Electrical Characteristics table of this datasheet. Once the RON of the device is determined based

upon the VIN and VBIAS voltage conditions, use Equation 5 to calculate the input to output voltage drop.

where

•

ΔV is the voltage drop from IN to OUT

•

ILOAD is the load current

•

RON is the On-Resistance of the device for a specific VIN and VBIAS

(5)

An appropriate ILOAD must be chosen such that the IMAX specification of the device is not violated.

10.1.2 Thermal Considerations

The maximum IC junction temperature must be restricted to just under the thermal shutdown (TSD) limit of the

device. To calculate the maximum allowable dissipation, PD(max) for a given output current and ambient

temperature, use Equation 6.

where

•

PD(max) is the maximum allowable power dissipation

•

TJ(max) is the maximum allowable junction temperature before hitting thermal shutdown (see the Electrical

Characteristics table)

•

TA is the ambient temperature of the device

•

θJA is the junction to air thermal impedance. See the Thermal Information section. This parameter is highly

dependent upon board layout.

(6)

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