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TPS22954, TPS22953

SLVSCT5D – MARCH 2015 – REVISED SEPTEMBER 2016

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Copyright © 2015–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

See TSD specification in the Electrical Characteristics section and Thermal Considerations section.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

Input voltage

–0.3

6

V

VBIAS

Bias voltage

–0.3

6

V

VOUT

Output voltage

–0.3

6

V

VEN, VSNS,

VPG

EN, SNS, and PG voltage

–0.3

6

V

IMAX

Maximum continuous switch current, TA = 70°C

5

A

IPLS

Maximum pulsed switch current, pulse < 300 µs, 2% duty cycle

7

A

TJ,MAX

Maximum junction temperature

Internally limited (2)

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±750

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the

maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package

in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max))

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN

Input voltage

0.7

VBIAS

V

VBIAS

Bias voltage

2.5

5.7

V

VOUT

Output voltage

0

5.7

V

VEN, VSNS,

VPG

EN, SNS, and PG voltage

0

5.7

V

TA

(1)

Operating free-air temperature

–40

105

°C

TJ

Operating junction temperature

–40

125

°C