www.ti.com

EXAMPLE BOARD LAYOUT

10X (0.5)

8X (0.5)

(0.84)

(2.4)

(

0.2) TYP

VIA

(0.95)

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

(1.9)

10X (0.25)

(R0.05) TYP

4218281/C

11/2022

WSON - 0.8mm max height

DQC0010A

PLASTIC SMALL OUTLINE - NO LEAD

SYMM

SYMM

1

5

6

10

11

LAND PATTERN EXAMPLE

SCALE: 30X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

METAL

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)