ADP5501 datasheet(5/28 Pages) AD

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ADP5501

Rev. 0 | Page 5 of 28

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VBAT to GND

–0.3 V to +6 V

VDDIO to GND

–0.3 V to VBAT

SW/BST to GND

–0.3 V to +30 V

LED0/LED1/LED2/CMP_IN/SCL/SDA/INT/

RST/CAP_OUT/BL_SNK to GND

–0.3 V to +6 V

PGND to GND

–0.3 V to +0.3 V

Operating Ambient Temperature Range

−40°C to +85°C1

Operating Junction Temperature Range

–40°C to +125°C

Storage Temperature Range

–65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

1 In applications where high power dissipation and poor thermal resistance

are present, the maximum ambient temperature may have to be derated.

Maximum ambient temperature (TA(MAX)) is dependent on the maximum

operating junction temperature (TJ(MAXOP) = 125°C), the maximum power

dissipation of the device (PD(MAX)), and the junction-to-ambient thermal

resistance of the part/package in the application (θJA), using the following

equation: TA(MAX) = TJ(MAXOP) – (θJA x PD(MAX)).

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to GND.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

Unit

24-Lead LFCSP_VQ

⁰C/W

ESD CAUTION

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