TMS320 datasheet(56/69 Pages) TI

56 / 69 page

TMS320C25

TMS320C25-50

SPRS010B — MAY 1987 — REVISED NOVEMBER 1990

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77001

68-lead plastic leaded chip carrier package (TMS320C25 and TMS320C25-50)

ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

25,27 (0.995)

25,02 (0.985)

24,33 (0.956)

24,13 (0.950)

0,81 (0.032)

0,66 (0.026)

0,51 (0.020)

0,36 (0.014)

1,52 (0.060)

Min

0,64 (0.025)

Min

4,50 (0.177)

4,24 (0.167)

2,79 (0.110)

2,41 (0.095)

1,27 (0.050) T.P.

(see Note B)

0,25 (0.010) R Max

3 Places

(see Note A)

25,27 (0.995)

25,02 (0.985)

24,33 (0.956)

24,13 (0.950)

(see Note A)

23,62 (0.930)

23,11 (0.910)

(At Seating Plane)

1,35 (0.053)

1,19 (0.047)

θJA

Junction-to-free-air

thermal resistance

°C/W

θJC

Junction-to-case

thermal resistance

°C/W

PARAMETER

MAX

UNIT

Thermal Resistance Characteristics

Seating

Plane

Lead Detail

1,22 (0.048)

1,07 (0.042)

× 45°

0,94 (0.037)

0,69 (0.027) R

NOTES: A. Centerline of center pin, each side, is within 0,10 (0.004) of package centerline as determined by this dimension.

B. Location of each pin is within 0,127 (0.005) of true position with respect to center pin on each side.

WARNING

When reflow soldering is required, refer to page 54 for special handling instructions.

TMS320 Datasheet(PDF) 56 Page - Texas Instruments

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