AM3517 datasheet(66/184 Pages) TI

66 / 184 page

SRAM_LDO1

SRAM_LDO2

WKUP_LDO

DPLL_MPU

DPLL_CORE

vdds_dpll_mpu

_usbhost

vdds_sram_mpu

DPLL5

DPLL4

vdds_dpll_per_core

Video DAC

vdda_dac

Device

VSS

vssa_dac

Cvdds_sram_mpu

vdds_sram_core_bg

Ccap_vdd_sram_core

Cvdds_dpll_mpu_usbhost

Cvdds_dpll_per_core

Cvdda_dac

vdda_dac

vdds_dpll_per_core

vdds_dpll_mpu_usbhost

Core

vdd_core

Cvdd_core

Vdd_core

030-004

MPU

Cvdds_sram_core_bg

Cvdd_sram_core

cap_vdd_sram_mpu

Ccap_vdd_sram_mpu

vdd_sram_core

cap_vdd_sram

_core

vdds_sram_mpu

vdd_sram_core

vdds_sram_core_bg

AM3517/05 ARM Microprocessor

SPRS550 – OCTOBER 2009

www.ti.com

Figure 3-2 illustrates an example of power supply decoupling.

(1)

Decoupling capacitors must be placed as closed as possible to the power ball. Choose the ground located closest to the power pin

for each decoupling capacitor. Place the decoupling capacitor Ci in a group of 1, 2, or 3 balls; the total must be equal to the

decoupling requirement. In case you interconnect powers, first insert the decoupling capacitor and then interconnect the powers.

(2)

The decoupling capacitor value depends on the board characteristics.

Figure 3-2. Power Supply Decoupling

ELECTRICAL CHARACTERISTICS

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AM3517 Datasheet(PDF) 66 Page - Texas Instruments

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