ADS1246 datasheet(3/66 Pages) TI

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ADS1246

ADS1247

ADS1248

www.ti.com

SBAS426D – AUGUST 2008 – REVISED MARCH 2010

THERMAL INFORMATION

ADS1246,

ADS1247,

ADS1248

THERMAL METRIC(1)

UNITS

TSSOP (IPW)

qJA

Junction-to-ambient thermal resistance(2)

54.6

qJC(top)

Junction-to-case(top) thermal resistance (3)

11.3

qJB

Junction-to-board thermal resistance (4)

13.0

°C/W

yJT

Junction-to-top characterization parameter (5)

0.5

yJB

Junction-to-board characterization parameter (6)

12.7

qJC(bottom)

Junction-to-case(bottom) thermal resistance (7)

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard

test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7).

(6)

The junction-to-board characterization parameter, yJB estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining qJA , using a procedure described in JESD51-2a (sections 6 and 7).

(7)

The junction-to-case(bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

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