ADRF6801 datasheet(25/36 Pages) AD

25 / 36 page

ADRF6801

Rev. 0 | Page 25 of 36

The package for the ADRF6801 features an exposed paddle on

the underside that should be well soldered to an exposed

opening in the solder mask on the evaluation board. Figure 43

illustrates the dimensions used in the layout of the ADRF6801

footprint on the ADRF6801 evaluation board (1 mil. = 0.0254 mm).

Note the use of nine via holes on the exposed paddle. These

ground vias should be connected to all other ground layers on

the evaluation board to maximize heat dissipation from the device

package. Under these conditions, the thermal impedance of the

ADRF6801 was measured to be approximately 30°C/W in still air.

0.168

0.232

0.177

0.035

0.050

0.012

0.025

0.020

Figure 43. Evaluation Board Layout Dimensions for the ADRF6801 Package

Figure 44. ADRF6801 Evaluation Board Top Layer

Figure 45. ADRF6801 Evaluation Board Bottom Layer

Table 5. Evaluation Board Configuration Options

Component

Function

Default Condition

VCC, VCC2, VCC4, VCO_LDO, VCC_LO,

VCC_LO1, VCC_RF, VCC_BB1, 3P3V1,

2P5V, CLK, DATA, LE, CP, DIG_GND,

GND, GND1, GND2

Power supply, ground and other test points.

Connect a 5 V supply to VCC.

VCC, VCC2, VCC4, VCC_LO, VCC_RF, VCC_BB1,

VCC_LO1, VCO_LDO, 3P3V1, 2P5V =

Components Corporation TP-104-01-02,

CP, LE, CLK, DATA =

Components Corporation TP-104-01-06,

GND, GND1, GND2, DIG_GND =

Components Corporation TP-104-01-00

R1, R6, R7, R8, R13, R15, R17, R18,

R24, R25, R26, R27, R29, R31, R32,

R36, R49

Power supply decoupling. Shorts or power supply

decoupling resistors.

R1, R6, R7, R8 = 0 Ω (0402),

R13, R15, R17 = 0 Ω (0402),

R18, R24, R25, R26, R27 = 0 Ω (0402),

R29, R31, R32 = 0 Ω (0402),

R36 = 0 Ω (0402),

R49 = open (0402)

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