33810 datasheet(5/37 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33810

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

VPWR Supply Voltage(1)

VPWR

-1.5 to 45

VDC

VDD Supply Voltage(1)

VDD

-0.3 to 7.0

VDC

SPI Interface and Logic Input Voltage (CS, SI, SO, SCLK, OUTEN,

DIN0 - DIN3, GIN0 - GIN3, SPKDUR, NOMI, MAXI, RSP,RSN)

VIL

VIH

-0.3 to VDD

VDC

IGBT/General Purpose Gate Pre-driver Drain Voltage (VFB0 to VFB3)

VFB

-1.5 to 60

VDC

Injector Output Voltage (OUTx)

VOUTX

-1.5 to 60

VDC

General Purpose Gate Pre-driver Output Voltage (GDx)

VGDx

-0.3 to 10

VDC

Output Clamp Energy (OUT0 to OUT3)(Single Pulse)

TJUNCTION = 150°C, IOUT = 1.5 A

ECLAMP

100

Output Clamp Energy (OUT0 to OUT3)(Continuous Pulse)

TJUNCTION = 125°C, IOUT = 1.0 A (Max Injector frequency is 70 Hz)

ECLAMP

100

Output Continuous Current (OUT0 to OUT3)

TJUNCTION = 150°C

IOSSSS

2.0

Maximum Voltage for RSN and RSP inputs

VRSX

-0.3 - VDD

VDC

Frequency of SPI Operation (VDD = 5.0 V)

–

6.0

MHz

ESD Voltage(2), (3)

Human Body Model (HBM)

Machine Model (MM)

Charge Device Model (CDM)

VESD1

VESD2

VESD3

±2000

±200

±750

THERMAL RATINGS

Operating Temperature

Ambient

Junction2

Case

-40 to 125

-40 to 150

-40 to 125

°C

Storage Temperature

TSTG

-55 to 150

°C

Power Dissipation (TA = 25°C)

1.7

Peak Package flow Temperature During Solder Mounting

DWB Suffix

EW Suffix

TSOLDER

240

245

°C

Thermal Resistance

Junction-to-Ambient

Junction- to-Lead

Junction-to-Flag

RθJA

RθJL

RθJC

8.0

1.2

°C/W

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