2 ______________________________________________________________________________________

System Power Management

for Mobile Handset

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

BATT, OUT1, SAFE_OUT, and INVIB to AGND ....-0.3V to +6.0V

CHG_IN, OUT2, LED1, and LED2 to AGND .........-0.3V to +30V

COMP2, IRQ, RESET_IN, COMP1, SCL, SDA, CHG,

PWR_ON_CMP, REF, LDO1, LDO2, LDO3, LDO4,

PGND1 and PGND2 to AGND .............................-0.3V to +0.3V

WLP (derate 24.4mW/NC above +70NC)..........................1.9W

(Note 2)........................................................................41NC/W

Operating Temperature...................................... -40NC to +85NC

Junction Temperature .....................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS

Note 1: LX1 has internal clamp diodes to PGND1 and OUT1. LX2 has internal clamp diodes to PGND2 and OUT2. Applications

that forward bias these diodes should take care not to exceed the IC package power dissipation limit.

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-lay-

er board. For detailed information on package thermal considerations, refer to http://www.maxim-ic.com/thermal-tutorial.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

BATT

BATT Operating Voltage

2.9

5.5

V

BATT Shutdown Supply Current

0.4

1

F

A

0.4

BATT Standby Supply Current

5

10

F

A

5

BATT Biasing Supply Current

60

F

A

Undervoltage Lockout (UVLO)

Threshold

BATT rising

2.6

2.75

2.9

V

Undervoltage Lockout Hysteresis

100

mV

THERMAL SHUTDOWN

Threshold

+160

N

C

Hysteresis

20

N

C

REFERENCE

Reference Output Voltage

1.200

V

Reference Supply Rejection

0.2

mV

LOGIC AND CONTROL INPUTS

Input Low Level

SDA, SCL, LDO1_EN, CHG, and RESET_IN

0.4

V

Input High Level

SDA, SCL, LDO1_EN, CHG, and RESET_IN

1.40

V

Logic-Input Current

SDA, SCL, LDO1_EN, CHG,

-1

+1

F

A

0.1