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LPC1111 Datasheet(PDF) 3 Page - NXP Semiconductors |
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LPC1111 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 64 page  LPC1111_12_13_14 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 22 June 2011 3 of 64 NXP Semiconductors LPC1111/12/13/14 32-bit ARM Cortex-M0 microcontroller 4. Ordering information Table 1. Ordering information Type number Package Name Description Version LPC1111FHN33/101 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1111FHN33/102 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1111FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1111FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1112FHN33/101 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1112FHN33/102 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1112FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1112FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1113FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1113FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1113FHN33/301 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1113FHN33/302 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1114FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1114FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1114FHN33/301 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1114FHN33/302 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1113FBD48/301 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2 LPC1113FBD48/302 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2 LPC1114FBD48/301 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2 LPC1114FBD48/302 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2 |
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