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LPC1111 Datasheet(PDF) 57 Page - NXP Semiconductors |
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LPC1111 Datasheet(HTML) 57 Page - NXP Semiconductors |
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57 / 64 page ![]() LPC1111_12_13_14 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 22 June 2011 57 of 64 NXP Semiconductors LPC1111/12/13/14 32-bit ARM Cortex-M0 microcontroller 13. Soldering Fig 35. Reflow soldering of the LQFP48 package SOT313-2 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP48 package Ax Bx Gx Gy Hy Hx Ay By P1 D2 (8 ×) D1 (0.125) Ax Ay Bx By D1 D2 Gx Gy Hx Hy 10.350 P2 0.560 10.350 7.350 7.350 P1 0.500 0.280 C 1.500 0.500 7.500 7.500 10.650 10.650 sot313-2_fr solder land C Generic footprint pattern Refer to the package outline drawing for actual layout P2 |
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