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LPC1111 Datasheet(PDF) 52 Page - NXP Semiconductors |
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LPC1111 Datasheet(HTML) 52 Page - NXP Semiconductors |
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52 / 64 page ![]() LPC1111_12_13_14 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 22 June 2011 52 of 64 NXP Semiconductors LPC1111/12/13/14 32-bit ARM Cortex-M0 microcontroller 11.3 XTAL Printed Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plain. Loops must be made as small as possible in Fig 30. Oscillator modes and models: oscillation mode of operation and external crystal model used for CX1/CX2 evaluation Table 18. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters) low frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 1 MHz - 5 MHz 10 pF < 300 18 pF, 18 pF 20 pF < 300 39 pF, 39 pF 30 pF < 300 57 pF, 57 pF 5 MHz - 10 MHz 10 pF < 300 18 pF, 18 pF 20 pF < 200 39 pF, 39 pF 30 pF < 100 57 pF, 57 pF 10 MHz - 15 MHz 10 pF < 160 18 pF, 18 pF 20 pF < 60 39 pF, 39 pF 15 MHz - 20 MHz 10 pF < 80 18 pF, 18 pF Table 19. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters) high frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 15 MHz - 20 MHz 10 pF < 180 18 pF, 18 pF 20 pF < 100 39 pF, 39 pF 20 MHz - 25 MHz 10 pF < 160 18 pF, 18 pF 20 pF < 80 39 pF, 39 pF 002aaf424 LPC1xxx XTALIN XTALOUT CX2 CX1 XTAL = CL CP RS L |
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