LPC1111 datasheet(58/64 Pages) NXP

Part #	LPC1111

Description	32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash and 8 kB SRAM

PDF	64 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

Logo

58 / 64 page

LPC1111_12_13_14

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 5 — 22 June 2011

58 of 64

NXP Semiconductors

LPC1111/12/13/14

32-bit ARM Cortex-M0 microcontroller

Fig 36. Reflow soldering of the HVQFN33 package

Footprint information for reflow soldering of HVQFN33 package

001aao134

occupied area

solder land

solder resist

solder land plus solder paste

solder paste deposit

Dimensions in mm

Remark:

Stencil thickness: 0.125 mm

e = 0.65

evia = 4.25

OwDtot = 5.10 OA

PID = 7.25 PA+OA

OID = 8.20 OA

0.20 SR

chamfer (4×)

W = 0.30 CU

evia = 2.40

LbD = 5.80 CU

LaD = 7.95 CU

DHS = 4.85 CU

4.55 SR

B-side

(A-side fully covered)

number of vias: 20

Solder resist

covered via

0.30 PH

0.60 SR cover

0.60 CU

SDhtot = 2.70 SP

0.45 DM

SPD = 1.00 SP

GapD = 0.70 SP

LPC1111 Datasheet(PDF) 58 Page - NXP Semiconductors

LPC1111 Datasheet(HTML) 58 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64

Datasheet Download

Link URL