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ELMOS Semiconductor AG

Data Sheet

QM-No.: 25DS0064E.01

PRELIMINARY INFORMATION - MAY 29, 2012

This document contains information on a pre-production product. ELMOS Semiconductor AG reserves the right to change specifications and information herein without notice.

LOW QUIESCENT CURRENT STEP DOWN CONVERTER FAMILY

3 Absolute Maximum Ratings

Stresses beyond these absolute maximum ratings listed below may cause permanent damage to the device. These are stress

ratings only; operation of the device at these or any other conditions beyond those listed in the operational sections of this

document is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

All voltages referred to V

Description

Condition

Symbol

Min

Max

Unit

Supply voltage at pin VIN

V

VIN

-0.3

40

V

Voltage at pin ON

V

ON

-0.3

40

V

Voltage at pin PGOOD

V

PGOOD

-0.3

40

V

Current at pin PGOOD

I

PGOOD

0

5

mA

Voltage at pin SENSE

V

SENSE

-0.3

6

V

Voltage at pin OCP

V

OCP

-0.3

0.8

V

Voltage at pin LXT

V

LXT

-10

V

V

Power dissipation (E522.01-06)

P

TOT

500

mW

Power dissipation (E522.07-09)

P

TOT

1

W

Storage temperature

T

STG

-50

+150

°C

4 ESD Protection

Description

Condition

Symbol

Min

Max

Unit

ESD HBM protection at pin VIN

1)

V

ESD(HBM)

3

kV

ESD HBM protection at all other pins

1)

V

ESD(HBM)

2

kV

ESD CDM protection at all pins

2)

V

ESD(CDM)

500

V

ESD CDM protection at corner pins

2)

V

ESD(CDM)C

750

V

1) According to AEC-Q100-002 (HBM) chip level test

2) According to AEC-Q100-011 (CDM) chip level test

5 Recommended Operating Conditions

Description

Condition

Symbol

Min

Max

Unit

Junction temperature

T

J

-40

+150

°C

Ambient temperature

T

amb

-40

+125

°C

Supply voltage at pin VIN

V

VIN

40

V

1) For V