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TPS65281RGVT Datasheet(PDF) 25 Page - Texas Instruments

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Part # TPS65281RGVT
Description  PRECISION ADJUSTABLE CURRENT LIMITED POWER DISTRIBUTION SWITCH WITH 4.5V TO 18V INPUT VOLTAGE, 3A OUTPUT CURRENT SYNCHRONOUS BUCK REGULATOR
PDF  31 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TPS65281RGVT Datasheet(HTML) 25 Page - Texas Instruments

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TPS65281, TPS65281-1
www.ti.com
SLVSBH7B – JULY 2012 – REVISED DECEMBER 2012
APPLICATION INORMATION
Thermal Shutdown
The device implements an internal thermal shutdown to protect itself if the junction temperature exceeds 160°C.
The thermal shutdown forces the buck converter to stop switching when the junction temperature exceeds
thermal trip threshold. Once the die temperature decreases below 140°C, the device reinitiates the power up
sequence. The thermal shutdown hysteresis is 20°C.
Power Dissipation and Junction Temperature
The total power dissipation inside TPS65281/TPS65281-1 should not exceed the maximum allowable junction
temperature of 125°C. The maximum allowable power dissipation is a function of the thermal resistance of the
package,
θJA, and ambient temperature. The analysis below gives an approximation in calculating junction
temperature based on the power dissipation in the package. However, it is important to note that thermal analysis
is strongly dependent on additional system level factors. Such factors include air flow, board layout, copper
thickness and surface area, and proximity to other devices dissipating power. Good thermal design practice must
include all system level factors in addition to individual component analysis.
To calculate the temperature inside the device under continuous load, use the following procedure.
1. Define the total continuous current through the buck converter (including the load current through power
switches). Make sure the continuous current does not exceed the maximum load current requirement.
2. From the graphs below, determine the expected losses (Y axis) in Watts for the buck converter inside the
device. The loss PD_BUCK depends on the input supply and the selected switching frequency. Please note,
the data is measured in the provided evaluation board (EVM).
3. Determine the load current IOUT through the power switch. Read RDS(on) of the power switch from the
Electrical Characteristics table.
4. The power loss through power switches can be calculated by:
PD_PW = RDS(on) × IOUT
(18)
5. The Dissipating Rating Table provides the thermal resistance,
θJA, for specific packages and board layouts.
6. The maximum temperature inside the IC can be calculated by:
TJ = PD_BUCK + PD_PW × θJA + TA
(19)
Where:
TA = Ambient temperature (°C)
θJA = Thermal resistance (°C/W)
PD_BUCK = Total power dissipation in buck converter (W)
PD_PW = Total power dissipation in power switches (W)
Figure 32. Buck Power Loss vs Output Current
Figure 33. Buck Power Loss vs Output Current
VIN = 12 V, fSW = 600 kHz
VIN = 12 V, fSW = 300 kHz
Copyright © 2012, Texas Instruments Incorporated
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Product Folder Links: TPS65281 TPS65281-1



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