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TPS65281RGVT Datasheet(PDF) 25 Page - Texas Instruments |
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TPS65281RGVT Datasheet(HTML) 25 Page - Texas Instruments |
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25 / 31 page ![]() TPS65281, TPS65281-1 www.ti.com SLVSBH7B – JULY 2012 – REVISED DECEMBER 2012 APPLICATION INORMATION Thermal Shutdown The device implements an internal thermal shutdown to protect itself if the junction temperature exceeds 160°C. The thermal shutdown forces the buck converter to stop switching when the junction temperature exceeds thermal trip threshold. Once the die temperature decreases below 140°C, the device reinitiates the power up sequence. The thermal shutdown hysteresis is 20°C. Power Dissipation and Junction Temperature The total power dissipation inside TPS65281/TPS65281-1 should not exceed the maximum allowable junction temperature of 125°C. The maximum allowable power dissipation is a function of the thermal resistance of the package, θJA, and ambient temperature. The analysis below gives an approximation in calculating junction temperature based on the power dissipation in the package. However, it is important to note that thermal analysis is strongly dependent on additional system level factors. Such factors include air flow, board layout, copper thickness and surface area, and proximity to other devices dissipating power. Good thermal design practice must include all system level factors in addition to individual component analysis. To calculate the temperature inside the device under continuous load, use the following procedure. 1. Define the total continuous current through the buck converter (including the load current through power switches). Make sure the continuous current does not exceed the maximum load current requirement. 2. From the graphs below, determine the expected losses (Y axis) in Watts for the buck converter inside the device. The loss PD_BUCK depends on the input supply and the selected switching frequency. Please note, the data is measured in the provided evaluation board (EVM). 3. Determine the load current IOUT through the power switch. Read RDS(on) of the power switch from the Electrical Characteristics table. 4. The power loss through power switches can be calculated by: PD_PW = RDS(on) × IOUT (18) 5. The Dissipating Rating Table provides the thermal resistance, θJA, for specific packages and board layouts. 6. The maximum temperature inside the IC can be calculated by: TJ = PD_BUCK + PD_PW × θJA + TA (19) Where: TA = Ambient temperature (°C) θJA = Thermal resistance (°C/W) PD_BUCK = Total power dissipation in buck converter (W) PD_PW = Total power dissipation in power switches (W) Figure 32. Buck Power Loss vs Output Current Figure 33. Buck Power Loss vs Output Current VIN = 12 V, fSW = 600 kHz VIN = 12 V, fSW = 300 kHz Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 25 Product Folder Links: TPS65281 TPS65281-1 |
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