AM3359 datasheet(162/236 Pages) TI

162 / 236 page

AM3359, AM3358, AM3357

AM3356, AM3354, AM3352

SPRS717F – OCTOBER 2011 – REVISED APRIL 2013

www.ti.com

Complete stackup specifications are provided in Table 5-46.

Table 5-46. PCB Stackup Specifications(1)

NO.

PARAMETER

MIN

TYP

MAX

UNIT

PCB routing and plane layers

Signal routing layers

Full ground layers under DDR2 routing region

Number of ground plane cuts allowed within DDR2 routing region

Full VDDS_DDR power reference layers under DDR2 routing region

Number of layers between DDR2 routing layer and reference ground plane

PCB routing feature size

mils

PCB trace width, w

mils

PCB BGA escape via pad size(2)

mils

PCB BGA escape via hole size(2)

mils

ZCZ package

0.5

AM335x BGA pad size

ZCE package

0.4

Single-ended impedance, Zo(3)

ohms

Impedance control(4)(5)

Zo-5

Zo+5

ohms

(1) For the DDR2 device BGA pad size, see the DDR2 device manufacturer documentation.

(2) A 20-10 via may be used if enough power routing resources are available. An 18-10 via allows for more flexible power routing to the

AM335x device.

(3) Zo is the nominal singled-ended impedance selected for the PCB.

(4) This parameter specifies the AC characteristic impedance tolerance for each segment of a PCB signal trace relative to the chosen Zo

defined by the single-ended impedance parameter.

(5) Tighter impedance control is required to ensure flight time skew is minimal.

162

Peripheral Information and Timings

Submit Documentation Feedback

Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352

AM3359 Datasheet(PDF) 162 Page - Texas Instruments

AM3359 Datasheet(HTML) 162 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL