AM3359 datasheet(163/236 Pages) TI

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OFFSET

Recommended DDR2

Device Orientation

OFFSET

DDR2

Device

AM335x

AM3359, AM3358, AM3357

AM3356, AM3354, AM3352

www.ti.com

SPRS717F – OCTOBER 2011 – REVISED APRIL 2013

5.6.2.2.2.4 Placement

Figure 5-41 shows the required placement for the DDR2 devices. The dimensions for this figure are

defined in Table 5-47. The placement does not restrict the side of the PCB on which the devices are

mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and allow for

proper routing space. For single-memory DDR2 systems, the second DDR2 device is omitted from the

placement.

Figure 5-41. AM335x Device and DDR2 Device Placement

Table 5-47. Placement Specifications(1)

NO.

PARAMETER

MIN

MAX

UNIT

X(2)(3)

1750

mils

Y(2)(3)

1280

mils

Y Offset(2)(3)(4)

650

mils

Clearance from non-DDR2 signal to DDR2 keepout region(5)(6)

(1) DDR2 keepout region to encompass entire DDR2 routing area.

(2) For dimension definitions, see Figure 5-41.

(3) Measurements from center of AM335x device to center of DDR2 device.

(4) For single-memory systems, it is recommended that Y offset be as small as possible.

(5) w is defined as the signal trace width.

(6) Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane.

Peripheral Information and Timings

163

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Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352

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