HC220 datasheet(95/182 Pages) ALTERA

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Package Information Datasheet for Mature Altera Devices

Altera Corporation

Package Information Datasheet for Mature Altera Devices

256-Pin FineLine Ball-Grid Array (FBGA), Option 2—Thin—Wire Bond

■

All dimensions and tolerances conform to ASME Y14.5M - 1994.

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Controlling dimension is in millimeters.

■

Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the

package surface.

1 This POD is applicable to F256 packages of the Cyclone II devices only.

Package Information

Description

Specification

Ordering Code Reference

Package Acronym

FBGA

Substrate Material

Solder Ball Composition

Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference

MO-192

Variation: DAF-1

Lead Coplanarity

0.008 inches (0.20 mm)

Weight

1.5 g (Typ.)

Moisture Sensitivity Level

Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min.

Nom.

Max.

—

1.55

0.25

—

1.05 REF

—

0.80

17.00 BSC

0.45

0.50

0.55

1.00 BSC

HC220 Datasheet(PDF) 95 Page - Altera Corporation

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