HC220 datasheet(97/182 Pages) ALTERA

Part #	HC220

Description	Package Information Datasheet for Mature Altera Devices

PDF	182 Pages

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Manufacturer	ALTERA [Altera Corporation]

Direct Link	http://www.altera.com

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Package Information Datasheet for Mature Altera Devices

Altera Corporation

Package Information Datasheet for Mature Altera Devices

324-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—Option 1

■

All dimensions and tolerances conform to ASME Y14.5M – 1994.

■

Controlling dimension is in millimeters.

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Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on

package surface.

Package Information

Description

Specification

Ordering Code Reference

Package Acronym

FBGA

Substrate Material

Solder Ball Composition

Regular: 63Sn:37Pb (Typ.)

Pb-free: Sn:3Ag:0.5Cu (Typ.)

JEDEC Outline Reference

MS-034 Variation: AAG-1

Lead Coplanarity

0.008 inches (0.20mm)

Weight

1.4 g (Typ.)

Moisture Sensitivity Level

Printed on moisture barrier bag

Package Outline Dimension Table

Symbol

Millimeters

Min.

Nom.

Max.

—

2.20

0.30

—

1.80

0.70 REF

19.00 BSC

0.50

0.60

0.70

1.00 BSC

HC220 Datasheet(PDF) 97 Page - Altera Corporation

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