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HC220 Datasheet(PDF) 24 Page - Altera Corporation |
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HC220 Datasheet(HTML) 24 Page - Altera Corporation |
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24 / 182 page ![]() 24 Package Information Datasheet for Mature Altera Devices Thermal Resistance Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation This change affects the APEX 20KE, APEX 20KC, APEX II, Mercury, and Excalibur device families. Therefore, two thermal resistance specifications are provided for devices affected by this change. The older packages are identified as using the aluminum silicon carbide (AlSiC) lid, while the newer packages are identified as using the copper (Cu) lid. Thermally enhanced BGA and thermally enhanced Flip Chip FBGA packages offered in the newer Altera families, including Stratix and Stratix GX, were introduced using an industry-standard Cu lid. Therefore, these device specifications include only a single thermal resistance specification. 1 Contact Altera if you need typical +/– values of A dimensions for thermal analysis. The max numbers are provided for physical layout. Arria Series Devices Thermal Resistance Table 26 provides thermal resistance values for Arria series devices. Arria GX Devices Table 26 lists the thermal resistance of Arria GX devices. Table 26. Thermal Resistance of Arria GX Devices Device Package Pin Count JA (° C/W) Still Air JA (° C/W) 100 ft./min. JA (° C/W) 200 ft./min. JA (° C/W) 400 ft./min. JC (° C/W) JB (° C/W) EP1AGX20 FBGA 484 12.8 10.3 8.7 7.5 0.3 3.1 FBGA 780 11.1 8.6 7.2 6.0 0.2 3.1 EP1AGX35 FBGA 484 12.8 10.3 8.7 7.5 0.3 3.1 FBGA 780 11.1 8.6 7.2 6.0 0.2 3.1 EP1AGX50 FBGA 484 12.7 10.2 8.6 7.3 0.2 2.9 FBGA 780 10.9 8.4 6.9 5.8 0.2 2.9 FBGA 1152 9.9 7.5 6.1 5.0 0.2 2.5 EP1AGX60 FBGA 484 12.7 10.2 8.6 7.3 0.2 2.9 FBGA 780 10.9 8.4 6.9 5.8 0.2 2.8 FBGA 1152 9.9 7.5 6.1 5.0 0.2 2.5 EP1AGX90 FBGA 1152 9.6 7.3 5.9 4.9 0.1 2.3 |
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