80960MC

iii

1.0 THE i960® MC PROCESSOR ................................................................................................................. .. 1

1.1 Key Performance Features ................................................................................................................. 2

1.1.1 Memory Space And Addressing Modes ................................................................................... 4

1.1.2 Data Types ............................................................................................................. .................. 4

1.1.3 Large Register Set ..................................................................................................... .............. 4

1.1.4 Multiple Register Sets .............................................................................................................. 5

1.1.5 Instruction Cache ..................................................................................................................... 5

1.1.6 Register Scoreboarding ................................................................................................. .......... 5

1.1.7 Memory Management and Protection ...................................................................................... 6

1.1.8 Floating-Point Arithmetic .............................................................................................. ............ 6

1.1.9 Multitasking Support ................................................................................................................ 7

1.1.10 Synchronization and Communication .................................................................................... 7

1.1.11 High Bandwidth Local Bus ..................................................................................................... 7

1.1.12 Multiple Processor Support .................................................................................................... 7

1.1.13 Interrupt Handling .................................................................................................... .............. 8

1.1.14 Debug Features ..................................................................................................................... 8

1.1.15 Fault Detection ....................................................................................................................... 8

1.1.16 Inter-Agent Communications (IAC) ...................................................................................... .. 9

1.1.17 Built-in Testability ................................................................................................................... 9

1.1.18 Compatibility with 80960K-Series ...................................................................................... .... 9

1.1.19 CHMOS ................................................................................................................. ................. 9

2.0 ELECTRICAL SPECIFICATIONS ................................................................................................ ........... 13

2.1 Power and Grounding ...................................................................................................... ................. 13

2.2 Power Decoupling Recommendations ......................................................................................... .... 13

2.3 Connection Recommendations ........................................................................................................ 13

2.4 Characteristic Curves ....................................................................................................................... 13

2.5 Test Load Circuit .............................................................................................................................. 16

2.7 DC Characteristics ....................................................................................................... ..................... 17

2.6 Absolute Maximum Ratings .............................................................................................................. 17

2.8 AC Specifications ............................................................................................................................. 18

2.9 Design Considerations ..................................................................................................................... 22

3.0 MECHANICAL DATA .............................................................................................................................. 22

3.1 Packaging ......................................................................................................................................... 22

3.1.1 Pin Assignment ...................................................................................................................... 22

3.2 Pinout ............................................................................................................................................... 26

3.3 Package Thermal Specification ........................................................................................................ 28

4.0 WAVEFORMS ......................................................................................................................................... 30

5.0 REVISION HISTORY ............................................................................................................................... 35