80960MC datasheet(32/39 Pages) INTEL

32 / 39 page

PRELIMINARY

80960MC

3.3

Package Thermal Specification

The 80960MC is specified for operation when case

temperature is within the range 0°C to 85°C (PGA).

Measure case temperature at the top center of the

package. Ambient temperature can be calculated

from:

•TJ = TC + P*θjc

•TA = TJ + P*θja

•TC = TA + P*[θja−θjc]

Values for

ja and θjc for various airflows are given in

Table 10 for the PGA package. The PGA’s

ja can

be reduced by adding a heatsink.

Maximum

allowable

ambient

temperature

(TA)

permitted without exceeding TC is shown by the

graphs in Figure 23, Figure 24 and Figure 25. The

curves assume the maximum permitted supply

current (ICC) at each speed, VCC of +5.0 V and a

TCASE of +85° C (PGA).

Table 10. 80960MC PGA Package Thermal Characteristics

Thermal Resistance — °C/Watt

Parameter

Airflow — ft./min (m/sec)

(0)

(0.25)

100

(0.50)

200

(1.01)

400

(2.03)

600

(3.04)

800

(4.06)

θ Junction-to-Case

222

θ Case-to-Ambient

(No Heatsink)

θ Case-to-Ambient

(Omnidirectional

Heatsink)

θ Case-to-Ambient

(Unidirectional

Heatsink)

NOTES:

1. This table applies to 80960MC PGA plugged into socket or soldered directly to board.

JA = θJC + θCA

J-CAP = 4°C/W (approx.)

J-PIN = 4°C/W (inner pins) (approx.)

J-PIN = 8°C/W (outer pins) (approx.)

J-PIN

J-CAP

80960MC Datasheet(PDF) 32 Page - Intel Corporation

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