µPD9903

23

6.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the conditions recommended below.

For details of recommended soldering conditions, refer to the information document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended, please contact your NEC sales

representative.

SURFACE MOUNT TYPE

µPC9903GT: 48-pin plastic shrink SOP (375 mil)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared ray reflow

Package peak temperature: 235 ˚C

IR35-00-1

Reflow time: 30 sec. max. (210 ˚C or above)

Number of times: 1 time

Partial heating

Pin temperature: 300 ˚C max.

–

method

Heat time: 3 sec. max. (per each side of the device)