TPS717

SBVS068H – FEBRUARY 2006 – REVISED JANUARY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating temperature range (unless otherwise noted), all voltages are with respect to GND

(1)

MIN

MAX

UNIT

–0.3

7

V

–0.3

3.6

V

Voltage

–0.3

3.6

V

–0.3

(2)

V

–0.3

7

V

Current

Internally limited

A

Continuous total power dissipation

See Thermal Information

Operating junction temperature

–55

150

°C

Storage temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

2.5

6.5

V

Output voltage

0.9

5

V

Output current

0

150

mA

Enable voltage

0

V

Output capacitor

1

100

µF

Junction temperature

–40

125

°C

6.4 Thermal Information

TPS717xx

DCK

DRV

DSE

UNIT

5 PINS

6 PINS

6 PINS

Junction-to-ambient thermal resistance

279.2

71.1

190.5

Junction-to-case (top) thermal resistance

57.5

96.5

94.9

Junction-to-board thermal resistance

74.1

40.5

149.3

°C/W

Junction-to-top characterization parameter

0.8

2.7

6.4

Junction-to-board characterization parameter

73.1

40.9

152.8

Junction-to-case (bottom) thermal resistance

n/a

10.7

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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