LM3102, LM3102-Q1

SNVS515H – SEPTEMBER 2007 – REVISED JUNE 2015

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Pin Functions (continued)

PIN

TYPE

DESCRIPTION

NAME

PIN NO.

BALL NO.

A1

17

B1

PGND

Ground

Power Ground

C1

18

D1

EP

EP

—

Ground

Exposed Pad

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN, RON to AGND

–0.3

43.5

V

SW to AGND

–0.3

43.5

V

SW to AGND (Transient)

–2 (< 100 ns)

V

VIN to SW

–0.3

43.5

V

BST to SW

–0.3

7

V

All Other Inputs to AGND

–0.3

7

V

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage Range (VIN)

4.5

42

V

−40

125

°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Ratings are conditions

under which operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical

Characteristics.

6.4 Thermal Information

LM3102,

LM3102

LM3102-Q1

UNIT

PWP (HTSSOP)

YPA (DSBGA)

20 PINS

28 PINS

Junction-to-ambient thermal resistance

30

50

°C/W

Junction-to-case (top) thermal resistance

6.5

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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