| Electronic Components Datasheet Search |
|
LM3102 Datasheet(PDF) 16 Page - Texas Instruments |
|
|
|
|||||||||||||||||||||||||||||
LM3102 Datasheet(HTML) 16 Page - Texas Instruments |
|
16 / 30 page ![]() LM3102, LM3102-Q1 SNVS515H – SEPTEMBER 2007 – REVISED JUNE 2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LM3102/-Q1 is a step-down DC-to-DC controller. It is typically used to convert a higher DC voltage to a lower DC voltage with a maximum output current of 2.5 A. The following design procedure can be used to select components for the LM3102/-Q1. Alternately, the WEBENCH software may be used to generate complete designs. When generating a design, the WEBENCH® software uses iterative design procedure and accesses comprehensive databases of components. For more details, go to www.ti.com. 8.2 Typical Application Figure 24. Typical Application Schematic 8.2.1 Design Requirements For this example the following application parameters exist. • VIN Range = 8 V to 42 V • VOUT = 3.3 V • IOUT = 2.5 A Refer to Detailed Design Procedure for more information on operational guidelines and limits. 8.2.2 Detailed Design Procedure 8.2.2.1 Design Steps for the LM3102/-Q1 Application The LM3102/-Q1 is fully supported by WEBENCH which offers the following: component selection, electrical simulation, thermal simulation, as well as the build-it prototype board for a reduction in design time. The following list of steps can be used to manually design the LM3102/-Q1 application. 1. Program VO with divider resistor selection. 2. Program turnon time with soft-start capacitor selection. 3. Select CO. 4. Select CIN. 5. Set operating frequency with RON. 6. Determine thermal dissipation. 7. Lay out PCB for required thermal performance. 16 Submit Documentation Feedback Copyright © 2007–2015, Texas Instruments Incorporated Product Folder Links: LM3102 LM3102-Q1 |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |