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ADP3430 Datasheet(PDF) 11 Page - ON Semiconductor |
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ADP3430 Datasheet(HTML) 11 Page - ON Semiconductor |
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11 / 26 page ![]() ADP3430 http://onsemi.com 11 If the IMON and OCP are then desired to be changed based on the TDC of the CPU, the ILIM resistor is the only component that needs to be changed. If the IMON scaling is the only desired change, then just changing the IMON resistor accomplishes this. The IMON pin also includes an active clamp to limit the IMON voltage to 1.15 V MAX yet maintaining 1.0 V MIN full−scale accurate reporting. Power−Good Monitoring The power−good comparator monitors the output voltage via the CSREF pin. The PWRGD pin is an open−drain output whose high level, when connected to a pullup resistor, indicates that the output voltage is within the nominal limits specified based on the VID voltage setting. PWRGD goes low if the output voltage is outside of this specified range, if the VID DAC inputs are in no CPU mode, or if the EN pin is pulled low. The PWRGD circuitry also incorporates an initial turn−on delay time (TD5), based on the DELAY timer. Prior to the SS voltage reaching the programmed VID DAC voltage and the PWRGD masking−time finishing, the PWRGD pin is held low. Once the SS pin is within 100 mV of the programmed DAC voltage, the capacitor on the DELAY pin begins to charge. A comparator monitors the DELAY voltage and enables PWRGD when the voltage reaches 1.7 V. The PWRGD delay time is, therefore, set by a current of 15 mA, charging a capacitor from 0 V to 1.7 V. High Frequency Current Balance Randomization for phases is implemented, in order to prevent high frequency current/thermal imbalance due to load and voltage regulator synchronization. Power State Indicator The PSI pin is used as an input to determine the operating power state of the load. If this pin is pulled low, the controller knows the load is in a low power state and it takes the ODN signal low, which can be used to disable phases for increased efficiency. PSI supports OTF change. One additional feature of the ADP3430 is the internal current limit threshold is changed when PSI is pulled low. The current limit threshold is reduced by 2/3 such that the same per phase average current limit is maintained to protect the components in the system. Figure 7. Efficiency Comparison (PSI High vs. Low) (Vin = 12 V, Vo = 1.51875 V, Fs = 375 kHz) 0.5 0.55 0.6 0.65 0.7 0.75 0.8 0.85 0.9 0 10 2030 4050 6070 80 Load Current (A) 3−Phase (PSI High) 2−Phase (PSI Low) Output Crowbar To protect the load and output components of the supply, the PWM outputs are driven low, which turns on the low−side MOSFETs when the output voltage exceeds the upper crowbar threshold. This crowbar action stops once the output voltage falls below the release threshold of approximately 375 mV. Turning on the low−side MOSFETs pulls down the output as the reverse current builds up in the inductors. If the output overvoltage is due to a short in the high−side MOSFET, this action current limits the input supply or blows its fuse, protecting the microprocessor from being destroyed. Output Enable and UVLO For the ADP3430 to begin switching, the input supply current to the controller must be higher than the UVLO threshold and the EN pin must be higher than its 0.8 V threshold. This initiates a system startup sequence. If either UVLO or EN is less than their respective thresholds, the ADP3430 is disabled. This holds the PWM outputs at ground, shorts the DELAY capacitor to ground, and the forces PWRGD and OD signals low. In the application circuit, the OD pin should be connected to the OD input of the external driver for the phase that is always on (phase 1 and 2) while the ODN pin should be connected to the OD input on the external drivers of the phase 3. Grounding OD and ODN disable the drivers such that both DRVH and DRVL are grounded. This feature is important in preventing the discharge of the output capacitors when the controller is shut off. If the driver outputs are not disabled, a negative voltage can be generated during output due to the high current discharge of the output capacitors through the inductors. Thermal Monitoring The ADP3430 includes a thermal monitoring circuit to detect when a point on the VR has exceeded a user−defined temperature. The thermal monitoring circuit requires an NTC thermistor to be placed between TTSNS and GND. A fixed current of 123 mA is sourced out of the TTSNS pin and into the thermistor. The current source is internally limited to 5.0 V. An internal circuit compares the TTSNS voltage to a 0.81 V threshold, and outputs an open−drain signal at the VRHOT output. Once the voltage on the TTSNS pin drops below its threshold, the open−drain output asserts high to signal the system that an overtemperature event has occurred. Because the TTSNS voltage changes slowly with respect to time, 55 mV of hysteresis is built into this comparator. The thermal monitoring circuitry does not depend on EN and is active when UVLO is above its threshold. When UVLO is below its threshold, VRHOT is forced low. |
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