DLPC200

DLPS014E – APRIL 2010 – REVISED AUGUST 2014

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Table of Contents

Blanking Requirements ............................................ 34

1

Features .................................................................. 1

7

Detailed Description ............................................ 35

2

Applications ........................................................... 1

7.1

Overview ................................................................. 35

3

Description ............................................................. 1

7.2

Functional Block Diagram ....................................... 35

4

Revision History..................................................... 2

7.3

Feature Description................................................. 35

5

Pin Configuration and Functions ......................... 5

7.4

Device Functional Modes........................................ 36

6

Specifications....................................................... 20

8

Application and Implementation ........................ 37

6.1

Absolute Maximum Ratings .................................... 20

8.1

Application Information............................................ 37

6.2

Handling Ratings..................................................... 20

8.2

Typical Application .................................................. 37

6.3

Recommended Operating Conditions ..................... 20

9

Power Supply Recommendations ...................... 44

6.4

Thermal Information ................................................ 20

9.1

Power-Up Requirements......................................... 44

6.5

I/O Electrical Characteristics ................................... 21

9.2

Power-Down Requirements .................................... 44

6.6

Video Input Pixel Interface Timing Requirements... 21

10

Layout................................................................... 45

6.7

10.1

Layout Guidelines ................................................. 45

6.8

USB Read Interface Timing Requirements............. 25

10.2

Layout Example .................................................... 45

6.9

USB Write Interface Timing Requirements ............. 26

10.3

Thermal Considerations ........................................ 46

6.10

SPI Slave Interface Timing Requirements ............ 27

11

Device and Documentation Support ................. 47

6.11

Parallel Flash Interface Timing Requirements ...... 28

11.1

Device Support...................................................... 47

6.12

Serial Flash Interface Timing Requirements......... 30

11.2

Documentation Support ........................................ 47

6.13

Static RAM Interface Timing Requirements.......... 31

11.3

Trademarks ........................................................... 47

6.14

DMD Interface Timing Requirements.................... 31

11.4

Electrostatic Discharge Caution ............................ 47

6.15

DLPA200 Interface Timing Requirements ............ 32

11.5

Glossary ................................................................ 48

6.16

DDR2 SDR Memory Interface Timing

Requirements........................................................... 33

12

Mechanical, Packaging, and Orderable

6.17

Video Input Pixel Interface – Image Sync and

Information ........................................................... 48

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (March 2012) to Revision E

Page

•

Added Handling Ratings table, Feature Description section, Device Functional Modes, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1

•

Updated descriptions in Pin Functions table .......................................................................................................................... 6

•

Added Grounding scheme for Video Port 1 signals if not used ............................................................................................ 6

•

Added Grounding scheme for video port 2 signals if not used ............................................................................................. 7

•

Added Connection scheme for EDID and USB if not used ................................................................................................... 8

•

Added Connection scheme for LED illumination Control if not used .................................................................................. 15

•

Added recommendation for 1-k

Ω pullup to 3.3 V ................................................................................................................ 15

•

Changed from "recommend grounding" to "recommend 10-k

Ω pulldown to DGND" for RSVD_S1, RSVD_S2,

RSVD_S3, RSVD_X11, RSVD_S20, and RSVD_S21 ......................................................................................................... 17

•

Changed description for RSVD_S0 from "do not connect" to "can be left open, recommend 10-k

Ω pullup to 2.5 V"......... 17

•

Changed pin description for RSVD_x15 and RSVD_X13 from "do not connect" to "do not leave open, required:

49.4-

Ω pullup to 1.8 V" ......................................................................................................................................................... 17

•

Changed pin description for RSVD_X14 and RSVD_X12 from "do not connect" to "do not leave open, required:

49.9-

Ω pulldown to DGND"................................................................................................................................................... 17

•

Changed from "do not connect" to "can be left open, recommend 10-k

Ω pullup to 1.8 V" for RSVD_S4 ........................... 17

•

Changed pin description for RSVD_S18 and RSVD_S19 from "do not connect" to "can be left open, recommend 10-

k

Ω pullup to 2.5 V"................................................................................................................................................................ 18

•

Deleted Case Temperature thermal resistance.................................................................................................................... 20

•

Changed Micron MT47H32M16-25E replaces now obsolete MT47H32M16R .................................................................... 43

2

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