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DLPC200 Datasheet(PDF) 3 Page - Texas Instruments |
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DLPC200 Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 52 page ![]() DLPC200 www.ti.com DLPS014E – APRIL 2010 – REVISED AUGUST 2014 Revision History (continued) • Added Note about LED enabling after initilization is complete............................................................................................. 44 • Added Heat Sink section ...................................................................................................................................................... 46 Changes from Revision C (February 2012) to Revision D Page • Changed the ADV time line in Figure 6 ................................................................................................................................ 28 Changes from Revision B (December 2010) to Revision C Page • Changed typo on pin number for PORT1_D10 Pin ................................................................................................................ 6 • Changed typo on pin number for USB_CLK Pin .................................................................................................................... 8 • Changed I/O type to B2 for USB interface data bus Pins ....................................................................................................... 8 • Added pin number A15 to PINFUNCTIONS table.................................................................................................................. 8 • Changed I/O type to B2 for Flash/SRAM data Pins.............................................................................................................. 11 • Corrected the I/O type to O3 on CFG_CSO terminal pin...................................................................................................... 16 • Added pin number AB17, U7, U8, and AD15 to Pin Functions table ................................................................................... 17 • Changed location of Absolute Maximum Ratings and Recommended Operating Conditions Tables in document............. 20 • Changed MIN and MAX TJ values in Recommended Operating Conditions ....................................................................... 20 • Added VCC33 and VREF_B2-4 pins to Recommended Operating Conditions ............................................................................ 20 • Changed Input Port Interface figure ..................................................................................................................................... 22 • Changed SPI Slave Interface Timing Requirements table ................................................................................................... 27 • Added SPI Timing diagram................................................................................................................................................... 27 • Changed RSTsignal timing in Parallel Flash Write Timing diagram..................................................................................... 29 • Changed signal notations in Serial Flash Interface Timing Requirements table.................................................................. 30 • Changed signal notations in Flash Memory Interface Timing diagram ................................................................................ 30 • Changed signal notations in DLPA200 I/F Timing diagram.................................................................................................. 32 • Changed Typical Application diagram .................................................................................................................................. 38 • Changed paragraph about read mode in Parallel Flash Memory Interface ......................................................................... 40 • Deleted SRAM Interface Timing diagram and provided reference to the OEM data sheet ................................................. 41 • Replaced "DAD" with "DLPA200" ......................................................................................................................................... 42 • Changed location of Device Marking in document ............................................................................................................... 47 Changes from Revision A (May 2010) to Revision B Page • Changed typo on pin number for MEM_D43 Pin ................................................................................................................. 14 • Changed typo on pin number for MEM_D62 Pin ................................................................................................................. 14 • Added part number used for EEPROM ................................................................................................................................ 40 • Changed part number for Winbond part............................................................................................................................... 41 • Added new section for Power-Down Requirements ............................................................................................................. 44 Changes from Original (April 2010) to Revision A Page • Added / changed pin names, updated descriptions in Pin Functions table ........................................................................... 6 • Changed junction temperature and notated need for heat sink ........................................................................................... 20 • Deleted unused types, updated values in I/O Characteristics table..................................................................................... 21 • Changed parameter names to match figure......................................................................................................................... 34 • Added new section for Power-Up Requirements ................................................................................................................. 44 Copyright © 2010–2014, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: DLPC200 |
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