LP5562 datasheet(4/52 Pages) TI1

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LP5562

SNVS820A – APRIL 2013 – REVISED SEPTEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

V (VDD, VEN/VCC, R, G, B, W)

−0.3

Voltage on pins

−0.3

VDD + 0.3 with 6-V max

Continuous power dissipation(2)

Internally limited

Junction temperature, TJ-MAX

125

°C

Maximum lead temperature (soldering)

See(3)

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and

disengages at TJ = 130°C (typical).

(3)

For detailed soldering specifications and information, please refer to Texas Instruments Application Note AN-1112 : DSBGA Wafer Level

Chip Scale Package (SNVA009).

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

±250

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

2.7

5.5

VEN/VCC

1.65

VDD

Junction temperature, TJ

−40

125

°C

Ambient temperature, TA

(1)

−40

°C

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature

(TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal

resistance of the part/package in the application (RθJA), as given by the equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.4 Thermal Information

LP5562

THERMAL METRIC(1)

YQE (DSBGA)

UNIT

12 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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